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KMID : 1007519980070010035
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Food Science and Biotechnology
1998 Volume.7 No. 1 p.35 ~ p.40
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Effects of Chemical Modification on Adhesive Properties of Glue Formulated with Soy Flour
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Rhee, Khee Choon
Kim, Kang Sung/Jang, Eun Kyung
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Abstract
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Break load values of adhesives formulated using 7S, 11S and soy flour were determined to be 75 ㎏. 72 ㎏, and 73 ㎏, respectively. Bonding study showed that hydrogen bonding and covalent bond were involved in adhesion: hydrophobic bond disrupting agent, SDS, had no effect on break load, while hydrogen bond and covalent bond interfering agents, urea and β-mercaptoethanol, respectively, caused decreases in break load values of the adhesives. 11S protein adhesive was especially susceptible to β-mercaptoethanol. Among protein modification reactions, phosphorylation was found to improve adhesiveness of the soy adhesive by approximately 10%, and also caused water resistance of the bonded joints to be significantly improved. Among chemicals added during formulation, glyoxal and glutaraldehyde improved water resistance while causing initial break load values of the formula to be decreased by about 10%. Crosslinking of the soy protein with transglutaminase also improved performance of the adhesive slightly.
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